SI3552DV-T1-E3 datasheet by Vishay Siliconix

SI3552DV-T1-E3 Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the SI3552DV-T1-E3?
  The recommended PCB footprint for the SI3552DV-T1-E3 is a 5-pin SOT23 package with a 1.5mm x 1.5mm body size. A minimum pad size of 0.8mm x 0.8mm is recommended for reliable soldering.
• How do I ensure the SI3552DV-T1-E3 operates within its recommended operating conditions?
  To ensure the SI3552DV-T1-E3 operates within its recommended operating conditions, maintain a voltage supply between 2.7V and 5.5V, and keep the junction temperature (TJ) below 150°C. Also, ensure the device is operated within its specified frequency range.
• What is the maximum allowable power dissipation for the SI3552DV-T1-E3?
  The maximum allowable power dissipation for the SI3552DV-T1-E3 is 250mW. Exceeding this limit may cause the device to overheat, leading to reduced performance or even failure.
• Can I use the SI3552DV-T1-E3 in a high-reliability or automotive application?
  Yes, the SI3552DV-T1-E3 is qualified for automotive and high-reliability applications. It meets the AEC-Q100 standard for automotive grade devices and is suitable for use in harsh environments.
• How do I handle ESD protection when handling the SI3552DV-T1-E3?
  To prevent electrostatic discharge (ESD) damage, handle the SI3552DV-T1-E3 with ESD-protective equipment, such as wrist straps or mats. Avoid touching the device's pins or exposing it to static-prone environments.