The recommended PCB footprint for the SI3552DV-T1-GE3 is a 5-pin SOT23 package with a 1.5mm x 2.5mm body size. A minimum pad size of 0.5mm x 0.5mm is recommended for each pin.
To ensure proper biasing, connect the input pin (VIN) to a stable voltage source between 2.5V and 5.5V, and the enable pin (EN) to a logic-level signal (0V or VIN). The output pin (VOUT) should be decoupled with a 1uF ceramic capacitor.
The SI3552DV-T1-GE3 is capable of delivering up to 150mA of output current. However, it's recommended to limit the output current to 100mA for optimal performance and to prevent overheating.
To ensure proper thermal management, provide a minimum of 1 square inch of copper area on the PCB for heat dissipation. Additionally, consider using thermal vias and a thermal pad on the bottom of the PCB to improve heat transfer.
Yes, the SI3552DV-T1-GE3 is AEC-Q100 qualified, making it suitable for automotive applications. However, it's essential to follow the recommended operating conditions and ensure the device is properly derated for high-temperature operation.
SI3552DV-T1-GE3 datasheet
by Vishay Siliconix
