SI3900DV-T1-E3 datasheet by Vishay Siliconix

SI3900DV-T1-E3 Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the SI3900DV-T1-E3?
  The recommended PCB footprint for the SI3900DV-T1-E3 is a 5-pin SOT23 package with a minimum pad size of 0.8mm x 0.8mm and a thermal pad size of 2.5mm x 2.5mm.
• How do I ensure the stability of the output voltage in the SI3900DV-T1-E3?
  To ensure the stability of the output voltage, it is recommended to use a minimum output capacitance of 1uF and a maximum ESR of 1 ohm. Additionally, the input capacitance should be at least 1uF with an ESR of 0.1 ohm or less.
• What is the maximum ambient temperature range for the SI3900DV-T1-E3?
  The maximum ambient temperature range for the SI3900DV-T1-E3 is -40°C to 125°C, with a junction temperature range of -40°C to 150°C.
• Can the SI3900DV-T1-E3 be used in automotive applications?
  Yes, the SI3900DV-T1-E3 is AEC-Q100 qualified, making it suitable for use in automotive applications.
• How do I calculate the power dissipation of the SI3900DV-T1-E3?
  The power dissipation of the SI3900DV-T1-E3 can be calculated using the formula: Pd = (Vin - Vout) x Iout, where Vin is the input voltage, Vout is the output voltage, and Iout is the output current.