The recommended PCB footprint for the SI4804CDY-T1-GE3 is a 1210 case size with a land pattern of 3.3mm x 2.5mm. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent overheating.
To ensure proper soldering, use a soldering iron with a temperature of 260°C (500°F) and a solder with a melting point of 220°C (428°F). Apply a small amount of solder paste to the PCB pads and place the component. Use a reflow oven or a hot air gun to solder the component, following the recommended soldering profile.
The SI4804CDY-T1-GE3 has an operating temperature range of -55°C to 150°C. However, it's recommended to operate the device within a temperature range of -40°C to 125°C for optimal performance and reliability.
Handle the SI4804CDY-T1-GE3 with care to prevent damage. Store the components in their original packaging or in a dry, ESD-protected environment. Avoid exposing the components to moisture, extreme temperatures, or physical stress during shipping and storage.
To prevent ESD damage, handle the SI4804CDY-T1-GE3 with ESD-protected equipment and wear an ESD wrist strap or use an ESD mat. Ensure the workspace is ESD-protected, and avoid touching the component's pins or leads.
SI4804CDY-T1-GE3 datasheet
by Vishay Siliconix
