The recommended PCB footprint for the SI6467BDQ-T1-E3 is a QFN-16 package with a 3x3 mm body size and 0.5 mm pitch. A recommended land pattern can be found in the Vishay Intertechnologies' QFN-16 package outline drawing.
To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and keeping the device within its specified operating temperature range (–40°C to 150°C).
The maximum allowed voltage on the enable pin (EN) of the SI6467BDQ-T1-E3 is 6 V. Exceeding this voltage may damage the device.
Yes, the SI6467BDQ-T1-E3 is suitable for switching regulator applications due to its low RDS(on) and high current handling capabilities. However, it's essential to ensure that the device is operated within its specified switching frequency range (up to 1 MHz) and that proper layout and decoupling practices are followed.
To handle ESD protection when working with the SI6467BDQ-T1-E3, follow proper ESD handling procedures, such as using an ESD wrist strap, ESD mat, or ESD-safe workbench. Additionally, ensure that the device is stored in its original packaging or an ESD-safe container when not in use.
SI6467BDQ-T1-E3 datasheet
by Vishay Siliconix
