The recommended PCB footprint for the SI6968BEDQ-T1-GE3 is a 5x5mm QFN package with a 0.5mm pitch. A detailed footprint recommendation can be found in the Vishay Intertechnologies application note AN10343.
To ensure reliability in high-temperature applications, it is recommended to follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, consider using thermal management techniques such as heat sinks or thermal interfaces to reduce the junction temperature.
The maximum allowed voltage on the input pins of the SI6968BEDQ-T1-GE3 is the supply voltage (VCC) + 0.3V. Exceeding this voltage may cause damage to the device.
Yes, the SI6968BEDQ-T1-GE3 is suitable for high-frequency switching applications. However, it is essential to consider the device's switching characteristics, such as rise and fall times, and ensure that the application's switching frequency is within the device's recommended operating range.
The SI6968BEDQ-T1-GE3 has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and handling to prevent damage to the device.
SI6968BEDQ-T1-GE3 datasheet
by Vishay Siliconix
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