A recommended PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, with multiple vias to dissipate heat. A minimum of 2 oz copper thickness is recommended.
To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C. Apply a small amount of solder paste to the pads and use a reflow oven or a hot air gun to solder the device. Avoid overheating the device.
The maximum allowed voltage on the gate pin is 20V. Exceeding this voltage may damage the device.
To protect the device from ESD, handle the device by the body or use an anti-static wrist strap. Use an ESD-safe workstation and ensure all tools and equipment are grounded.
The recommended operating frequency range for the SI7135DP-T1-GE3 is up to 100 kHz. Operating the device above this frequency may reduce its performance and reliability.
SI7135DP-T1-GE3 datasheet
by Vishay Siliconix
