The recommended PCB footprint for the SI7220DN-T1-GE3 is a 5-pin SOT23 package with a minimum pad size of 1.3 mm x 1.3 mm and a thermal pad size of 2.5 mm x 2.5 mm.
To ensure proper biasing, connect the input pins (VIN and VCC) to a stable voltage source, and ensure the output pin (VOUT) is decoupled with a 10uF ceramic capacitor. Additionally, maintain a minimum input voltage of 2.5V and a maximum input voltage of 5.5V.
The SI7220DN-T1-GE3 has an operating temperature range of -40°C to 150°C, with a junction temperature (TJ) maximum of 150°C.
To prevent ESD damage, handle the SI7220DN-T1-GE3 with an anti-static wrist strap or mat, and ensure the workspace is ESD-protected. Avoid touching the device's pins or leads, and use ESD-safe packaging and storage.
Store the SI7220DN-T1-GE3 in a dry, cool place (less than 30°C and 60% relative humidity) away from direct sunlight and moisture. Avoid exposing the device to extreme temperatures, humidity, or physical stress.
