The recommended PCB footprint for the SI7461DP-T1-GE3 is a standard SOT23-6 package with a 1.8mm x 1.4mm body size. A minimum pad size of 0.8mm x 0.8mm is recommended for reliable soldering.
To ensure proper biasing, connect the input pin (VIN) to a stable voltage source between 2.5V to 5.5V. The enable pin (EN) should be tied to VIN or a logic signal. The output pin (VOUT) should be decoupled with a 1uF ceramic capacitor to ensure stability.
The SI7461DP-T1-GE3 is capable of delivering up to 1A of output current. However, it's recommended to limit the output current to 500mA for optimal performance and to prevent overheating.
To protect the SI7461DP-T1-GE3 from overvoltage, add a TVS diode or a zener diode in parallel with the input pin (VIN). For overcurrent protection, add a current-limiting resistor or a PTC fuse in series with the output pin (VOUT).
The SI7461DP-T1-GE3 is rated for operation from -40°C to 125°C. However, it's recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance and reliability.