The recommended PCB footprint for the SI7850DP-T1-E3 is a 5-pin SOT23 package with a 1.5mm x 2.5mm body size. A minimum pad size of 0.5mm x 0.5mm is recommended for reliable soldering.
To ensure proper biasing, connect the input pin (VIN) to a stable voltage source between 2.5V and 5.5V. The output pin (VOUT) should be decoupled with a 1uF ceramic capacitor to reduce noise and improve stability.
The SI7850DP-T1-E3 is rated for operation from -40°C to 125°C. However, it's recommended to derate the output current by 50% when operating above 85°C to ensure reliable performance.
Yes, the SI7850DP-T1-E3 is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, it's essential to follow the recommended PCB layout, thermal management, and component selection guidelines to ensure reliable operation.
To troubleshoot issues, first verify the input voltage and decoupling capacitor values. Check for PCB layout issues, such as poor grounding or inadequate thermal management. If issues persist, consult the datasheet and application notes or contact Vishay's technical support for further assistance.
SI7850DP-T1-E3 datasheet
by Vishay Siliconix
