The recommended PCB footprint for the SI9945BDY-T1-GE3 is a 5-pin SOT23 package with a minimum pad size of 1.3 mm x 1.3 mm and a thermal pad size of 2.5 mm x 2.5 mm.
To ensure the SI9945BDY-T1-GE3 operates within its SOA, monitor the device's junction temperature, voltage, and current. Ensure the device is operated within the recommended voltage range (4.5 V to 18 V) and current range (up to 2 A).
The thermal resistance (RθJA) of the SI9945BDY-T1-GE3 is 125°C/W, and the thermal resistance (RθJC) is 45°C/W.
Yes, the SI9945BDY-T1-GE3 is suitable for high-reliability applications due to its robust design, high-temperature rating, and compliance with automotive and industrial standards.
To prevent electrostatic discharge (ESD) damage, handle the SI9945BDY-T1-GE3 with an ESD wrist strap or mat, and ensure the workspace is ESD-protected. Avoid touching the device's pins or handling it in a way that could generate static electricity.
SI9945BDY-T1-GE3 datasheet
by Vishay Siliconix
