Vishay recommends a PCB layout with a large copper area connected to the tab of the device to improve thermal dissipation. A minimum of 1 oz copper thickness is recommended, and the use of thermal vias can further enhance heat transfer.
To ensure reliable soldering, follow the recommended soldering profile: peak temperature of 260°C, time above 217°C of 20-40 seconds, and a maximum of 3 reflows. Use a solder with a melting point above 217°C, and avoid using solder with a high silver content.
The maximum allowed voltage imbalance between the input and output is ±10% of the nominal input voltage. Exceeding this limit may affect the device's reliability and performance.
While the SIHFR9120-GE3 is designed to operate in a wide range of temperatures, it is not recommended for use in high-humidity environments (>80% RH) without proper protection. Consider using conformal coating or potting to prevent moisture ingress.
Store the SIHFR9120-GE3 in a dry, cool place (<30°C, <60% RH) away from direct sunlight. Avoid storing the devices in close proximity to sources of moisture, chemicals, or radiation.
SIHFR9120-GE3 datasheet
by Vishay Siliconix
