Vishay recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a heat sink.
To ensure reliable soldering, follow the recommended soldering profile: peak temperature of 260°C, time above 217°C of 30 seconds, and a soldering iron temperature of 350°C. Use a solder with a melting point of 217°C or higher, and avoid using excessive solder or flux.
The maximum allowed voltage derating for the SIR172DP-T1-GE3 is 80% of the rated voltage. This means that if the device is rated for 1200 V, the maximum allowed voltage derating would be 960 V.
To handle ESD protection, ensure that the device is handled and stored in an ESD-protected environment. Use ESD-protective packaging, wrist straps, and mats, and follow proper ESD handling procedures. The SIR172DP-T1-GE3 has an ESD rating of 2 kV human body model (HBM) and 150 V machine model (MM).
The recommended storage condition for the SIR172DP-T1-GE3 is in a dry, cool place with a temperature range of -40°C to 30°C and a relative humidity of 60% or less. Avoid storing the device in direct sunlight or near heat sources.
SIR172DP-T1-GE3 datasheet
by Vishay Siliconix
Findchips
Findchips