SIR882DP-T1-GE3 Frequently Asked Questions (FAQs)

• What is the recommended land pattern for the SIR882DP-T1-GE3?
  The recommended land pattern for the SIR882DP-T1-GE3 can be found in the Vishay Intertechnologies' application note 'Land Pattern Recommendations for QFN and DFN Packages' (document number 28353).
• How do I handle the thermal pad on the SIR882DP-T1-GE3?
  The thermal pad on the SIR882DP-T1-GE3 should be connected to a solid ground plane to ensure optimal thermal performance. A thermal via or a thermal pad connection to the ground plane is recommended.
• What is the maximum operating temperature range for the SIR882DP-T1-GE3?
  The SIR882DP-T1-GE3 has an operating temperature range of -55°C to 150°C. However, the maximum junction temperature (TJ) should not exceed 150°C.
• Can I use the SIR882DP-T1-GE3 in a high-reliability application?
  Yes, the SIR882DP-T1-GE3 is suitable for high-reliability applications. It is manufactured using a qualified process and is compliant with the Automotive Electronics Council (AEC) Q100 and Q101 standards.
• How do I ensure the SIR882DP-T1-GE3 is properly soldered?
  To ensure proper soldering, follow the recommended soldering profile and temperature guidelines provided in the Vishay Intertechnologies' application note 'Soldering Guidelines for QFN and DFN Packages' (document number 28354).