SK810C datasheet by Taiwan Semiconductor

SK810C Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  A thermal pad is recommended under the SK810C package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern around the thermal pad are suggested. Additionally, a solid ground plane on the bottom layer can help reduce thermal resistance.
• How do I ensure reliable operation across the entire operating temperature range?
  To ensure reliable operation, it's essential to follow the recommended operating conditions, including voltage, current, and temperature. Additionally, consider implementing thermal management techniques, such as heat sinks or thermal interfaces, to maintain a safe junction temperature.
• What are the ESD protection recommendations for the SK810C?
  To prevent electrostatic discharge (ESD) damage, it's recommended to follow standard ESD handling procedures, such as using an ESD wrist strap or mat, and storing the devices in anti-static packaging. Additionally, consider implementing ESD protection circuits, such as TVS diodes or ESD protection arrays, in the system design.
• Can I use the SK810C in a high-reliability or automotive application?
  While the SK810C is a general-purpose device, it may not meet the specific requirements for high-reliability or automotive applications. It's recommended to consult with Taiwan Semiconductor or a qualified representative to determine the device's suitability for such applications and to discuss any necessary qualifications or certifications.
• What are the recommended soldering conditions for the SK810C?
  The recommended soldering conditions for the SK810C include a peak temperature of 260°C, a soldering time of 10 seconds or less, and a soldering method that minimizes thermal shock. It's also recommended to follow the IPC-J-STD-020 standard for soldering electronic components.