NXP provides a recommended PCB layout in the application note AN11529, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
The device has a thermal pad on the bottom, which should be connected to a thermal ground plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer. Additionally, ensure good airflow around the device and avoid blocking the airflow with nearby components.
The device is rated for operation from -40°C to 125°C (junction temperature), but the recommended operating temperature range is -20°C to 85°C for optimal performance and reliability.
The output voltage can be adjusted by connecting resistors between the FB pin and the output voltage sense pin (VSENSE) to create a resistive divider. The datasheet provides a formula to calculate the required resistor values for a specific output voltage.
NXP recommends using a low-ESR ceramic capacitor (X5R or X7R dielectric) with a value of 10 μF to 22 μF for the input capacitor (CIN). This helps to filter out noise and ensure stable operation.
