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    Part Img SL2S2002FUD,003 datasheet by NXP Semiconductors

    • SL2S2002FUD - ICODE SLIX, NAU000 Package, No Marking, Chips On Wafer, Single P, Pre-Sawn On FFC
    • Original
    • Yes
    • Unknown
    • Active
    • Find it at Findchips.com

    SL2S2002FUD,003 datasheet preview

    SL2S2002FUD,003 Frequently Asked Questions (FAQs)

    • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the layout symmetrical and avoid vias under the device. Use a 10nF decoupling capacitor between VDD and GND, and a 100nF capacitor between VDDA and GND.
    • Ensure good thermal conductivity by using a heat sink or a thermal pad on the exposed pad. Keep the device away from heat sources and ensure good airflow. Monitor the junction temperature (TJ) and adjust the operating conditions accordingly.
    • The recommended input voltage range is 2.7V to 5.5V. Operating outside this range may affect the device's performance and reliability.
    • The POR and BOD features are enabled by default. Use the POR pin to reset the device during power-up. The BOD threshold is 2.2V. Use an external resistor and capacitor to adjust the BOD threshold if needed.
    • The maximum allowed current for the I/O pins is 4mA. Exceeding this limit may cause damage to the device.
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