Texas Instruments provides a recommended PCB layout for the SM320VC33GNMM150EP in the 'TMS320VC33GNMM150EP ZWT Package Thermal Model' document. It suggests using a 4-layer PCB with a solid ground plane, and placing thermal vias under the device to improve heat dissipation.
The boot mode for the SM320VC33GNMM150EP can be configured using the boot mode pins (BM0-BM3). The boot mode pins are sampled during reset, and the device boots from the selected source (e.g., internal flash, external flash, or asynchronous peripherals). The boot mode configuration is described in the 'TMS320VC33GNMM150EP Boot Mode' document.
The maximum operating frequency for the SM320VC33GNMM150EP is 150 MHz. However, the actual operating frequency may be limited by the specific application, PCB design, and environmental conditions.
The SM320VC33GNMM150EP has several power management features, including power-down modes, clock gating, and voltage scaling. These features can be controlled using the Power Management Module (PMM) and the Clock Management Module (CMM). The 'TMS320VC33GNMM150EP Power Management' document provides more information on implementing power management for the device.
Texas Instruments recommends using a decoupling capacitor scheme that includes a combination of ceramic and electrolytic capacitors. The 'TMS320VC33GNMM150EP Power Supply Decoupling' document provides more information on the recommended decoupling capacitor scheme and placement guidelines.