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The SM6T68A can operate from -40°C to 150°C, making it suitable for high-reliability applications.
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Use a reflow soldering process with a peak temperature of 260°C for 20-30 seconds. Ensure the PCB is designed with a suitable land pattern and thermal relief to prevent thermal stress.
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Keep the layout compact and symmetrical to minimize parasitic inductance. Use a ground plane and place decoupling capacitors close to the device. Route high-frequency signals away from sensitive analog circuits.
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Use an ESD wrist strap or mat, and ensure the workspace is ESD-protected. Handle the device by the body, not the leads, and avoid touching the pins or die.
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Store the devices in their original packaging, away from direct sunlight and moisture. Handle the devices in a clean, dry environment, and avoid bending or flexing the leads.