SM6T6V8CA-E3/52 datasheet by Vishay Semiconductors

SM6T6V8CA-E3/52 Frequently Asked Questions (FAQs)

• What is the recommended footprint for the SM6T6V8CA-E3/52?
  The recommended footprint for the SM6T6V8CA-E3/52 is a standard SMD footprint with a pad size of 0.5 mm x 0.5 mm, and a spacing of 0.5 mm between pads.
• Can the SM6T6V8CA-E3/52 be used in high-temperature applications?
  Yes, the SM6T6V8CA-E3/52 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at extreme temperatures.
• How do I handle the SM6T6V8CA-E3/52 during assembly to prevent damage?
  Handle the SM6T6V8CA-E3/52 by the body, avoiding touching the leads or the glass passivation layer to prevent damage. Use anti-static wrist straps, mats, or other ESD protection methods to prevent electrostatic discharge damage.
• What is the recommended soldering profile for the SM6T6V8CA-E3/52?
  The recommended soldering profile for the SM6T6V8CA-E3/52 is a peak temperature of 260°C, with a dwell time of 10-30 seconds. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
• Can the SM6T6V8CA-E3/52 be used in high-humidity environments?
  Yes, the SM6T6V8CA-E3/52 is designed to operate in humid environments, but it's recommended to follow proper moisture-sensitive device handling and storage procedures to prevent damage.