The recommended land pattern for the SMBG100A-E3/52 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a solder mask clearance of 0.1 mm. It's also recommended to use a non-solder mask defined (NSMD) pad to ensure good solderability.
To prevent damage, handle the SMBG100A-E3/52 by the body or the leads, avoiding touching the glass passivation layer. Use anti-static wrist straps, mats, or trays to prevent electrostatic discharge (ESD) damage. Also, avoid bending or flexing the leads during assembly.
The maximum allowable voltage for the SMBG100A-E3/52 is 100 V, which is the maximum reverse voltage rating. Exceeding this voltage may cause permanent damage to the device.
The SMBG100A-E3/52 is rated for operation up to 150°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the voltage and current ratings according to the temperature derating curve provided in the datasheet.
To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C, and a solder with a melting point of 180°C to 220°C. Apply a small amount of solder to the lead and pad, and use a gentle touch to avoid applying excessive force or heat.
SMBG100A-E3/52 datasheet
by Vishay Semiconductors
