A 4-layer PCB with a dedicated ground plane and a solid copper pour on the top and bottom layers is recommended. Keep the component placement symmetrical and avoid routing high-frequency signals near the device.
Implement a robust thermal management system, such as a heat sink or thermal pad, to keep the junction temperature below 150°C. Also, ensure good airflow and avoid thermal hotspots on the PCB.
The device can withstand a maximum surge current of 100A for 10ms, but it's recommended to limit the surge current to 50A for 10ms to ensure reliable operation.
Yes, but it's crucial to ensure that the devices are matched in terms of voltage and current ratings, and that the PCB layout is designed to minimize current imbalance and thermal mismatch.
Start by checking the PCB layout and component placement for any errors or omissions. Then, verify the input voltage, current, and temperature ratings. Use a thermal imaging camera to detect any thermal hotspots, and perform a thorough visual inspection for signs of physical damage or contamination.
