Texas Instruments provides a recommended PCB layout in the application note SLVAE04, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
The SN65ELT21DGKR has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal via or a copper pour connected to a ground plane can be used to dissipate heat. Additionally, the device can be mounted on a heat sink or a metal core PCB to further improve thermal dissipation.
The maximum cable length supported by the SN65ELT21DGKR depends on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths up to 100 meters at 1 Gbps and up to 40 meters at 10 Gbps. Longer cable lengths may require the use of repeaters or active cables.
Yes, the SN65ELT21DGKR can be used in a multi-point or daisy-chain configuration, but it requires careful consideration of the signal integrity, power consumption, and thermal management. Texas Instruments provides guidelines for multi-point and daisy-chain configurations in the application note SLVAE04.
Texas Instruments provides a troubleshooting guide in the application note SLVAE04, which includes steps to identify and resolve common issues such as signal integrity problems, power consumption issues, and thermal management issues. Additionally, the device has built-in diagnostic features such as loopback and signal quality indicator pins that can be used to troubleshoot issues.
SN65ELT21DGKR datasheet
by Texas Instruments
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