Texas Instruments provides a recommended PCB layout in the application note SLVAE04, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
The SN65HVS882PWPRG4 has a thermal pad that must be connected to a thermal ground plane on the PCB to dissipate heat. A thermal via array or a thermal pad connected to a heat sink can be used to improve thermal dissipation. The device's junction-to-ambient thermal resistance (RθJA) is 30°C/W, and the maximum junction temperature (TJ) is 150°C.
Although the datasheet specifies an input voltage range of 3.3V to 5V, Texas Instruments recommends operating the device within a narrower range of 3.3V ± 10% to ensure optimal performance and minimize power consumption.
To ensure EMC compliance, follow the recommended PCB layout and routing guidelines, use a shielded enclosure, and add EMI filters or chokes as needed. Additionally, ensure that the device is operated within its specified frequency range and that the input and output signals are properly terminated.
The SN65HVS882PWPRG4 has a power-up sequence that ensures the device's outputs are in a high-impedance state until the internal voltage regulator is stable. During power-down, the device's outputs are also placed in a high-impedance state to prevent backdrive currents. The power-up and power-down sequences are described in the datasheet.
SN65HVS882PWPRG4 datasheet
by Texas Instruments
