Texas Instruments provides a recommended PCB layout in the application note SLVAE04, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure reliable operation.
The thermal pad on the bottom of the package should be connected to a solid ground plane on the PCB to dissipate heat effectively. A thermal via or a copper pour can be used to connect the thermal pad to the ground plane.
The maximum cable length that can be driven by the SN65LVDT101DG4 depends on the cable characteristics, signal frequency, and desired signal integrity. As a general guideline, the device can drive cables up to 100 meters long at 100 Mbps. However, it's recommended to perform signal integrity analysis and testing to determine the maximum cable length for a specific application.
To ensure EMC with the SN65LVDT101DG4, follow proper PCB layout and design guidelines, use shielding and filtering as needed, and ensure that the device is operated within its specified frequency range and signal amplitude. Additionally, perform EMC testing and certification according to relevant industry standards.
The recommended power-up sequence for the SN65LVDT101DG4 is to power up the VCC supply before the VEE supply. This ensures that the internal circuitry is properly initialized and configured before the device becomes active.
SN65LVDT101DG4 datasheet
by Texas Instruments
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