Texas Instruments provides a recommended PCB layout in the application note SLVAE03, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
The thermal pad on the SN65LVDT122D should be connected to a thermal ground plane on the PCB to dissipate heat efficiently. A thermal via or a copper pour connected to the thermal pad can be used to achieve this. It's essential to follow the recommended thermal management guidelines to prevent overheating and ensure reliable operation.
The maximum cable length supported by the SN65LVDT122D depends on the specific application and the type of cable used. As a general guideline, Texas Instruments recommends keeping the cable length as short as possible (less than 10 meters) to minimize signal attenuation and ensure reliable data transmission. For longer cable lengths, signal repeaters or amplifiers may be necessary.
The SN65LVDT122D is specified to operate with a 3.3V supply voltage, but it can tolerate a supply voltage range of 2.7V to 3.6V. However, operating the device outside the recommended voltage range may affect its performance, power consumption, and reliability. It's essential to consult the datasheet and application notes for specific guidance on operating the device with a different voltage supply.
To ensure EMC with the SN65LVDT122D, follow the recommended PCB layout and design guidelines, use proper shielding and grounding techniques, and implement EMI filtering and suppression components as necessary. Additionally, consult the Texas Instruments application note SLVAE03 for specific EMC guidelines and recommendations.
SN65LVDT122D datasheet
by Texas Instruments
