SN65LVDT352PWR datasheet by Texas Instruments

SN65LVDT352PWR Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal performance?
  Texas Instruments provides a recommended PCB layout in the application note SLVAE04, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
• How do I handle the thermal dissipation of the device?
  The SN65LVDT352PWR has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal via array or a copper pour on the PCB can be used to dissipate heat. Additionally, the device's thermal resistance can be reduced by using a heat sink or a thermal interface material.
• What is the maximum cable length supported by the device?
  The maximum cable length supported by the SN65LVDT352PWR depends on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths up to 100 meters at a data rate of 100 Mbps. For longer cable lengths, repeaters or active cables may be required.
• How do I configure the device for a specific application?
  The SN65LVDT352PWR has several configuration options, such as the ability to select the data rate, polarity, and termination. These options can be configured using external resistors, capacitors, and jumpers. Texas Instruments provides a configuration guide in the application note SLVAE03, which includes examples and guidelines for specific applications.
• What is the EMI performance of the device?
  The SN65LVDT352PWR is designed to meet the electromagnetic compatibility (EMC) requirements of various standards, including IEC 61000-4-2 and CISPR 25. The device's EMI performance can be further improved by following the recommended PCB layout and using EMI filters or shielding.