Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as keeping the input and output traces short, using a solid ground plane, and minimizing noise coupling. Additionally, consider using a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
To ensure reliable operation over the entire operating temperature range (-40°C to 125°C), it's crucial to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow. Additionally, consider using a thermistor or temperature sensor to monitor the device temperature and adjust the operating conditions accordingly.
To mitigate EMI and RFI, use proper shielding, grounding, and filtering techniques. Ensure that the device is placed in a shielded enclosure, and use ferrite beads or chokes to filter out high-frequency noise. Additionally, consider using a common-mode choke to reduce electromagnetic radiation.
Proper power sequencing and startup are critical to ensure reliable operation. Ensure that the power supplies are sequenced correctly, and the device is powered up slowly to prevent voltage overshoots. Consider using a power sequencer or a supervisor IC to manage the power-up sequence.
Use high-impedance probes and oscilloscopes with high-bandwidth and low-noise characteristics to measure the device's performance. Ensure that the measurement setup is properly calibrated and that the device is operated within its recommended operating conditions.
