TI recommends a 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device to improve heat dissipation. A minimum of 2 oz copper thickness is recommended.
Use a heat sink with a thermal resistance of ≤ 10°C/W, ensure good airflow, and follow the recommended PCB layout. Also, consider derating the device's power dissipation at high temperatures.
The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. However, for reliable operation, it's recommended to keep the input voltage within the specified operating range of 3.3V ± 10%.
Yes, the SN75976A1DLR is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q100 and is manufactured using automotive-grade processes.
Check the input voltage, output load, and PCB layout. Ensure that the device is properly decoupled, and the output capacitor is within the recommended range. Also, verify that the device is not overheating.