Texas Instruments provides a recommended PCB layout in the application note SLVAE04, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
The SN75LBC172A16DWR has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal via or a copper pour connected to a ground plane can be used to dissipate heat. Additionally, the device's thermal resistance can be reduced by using a heat sink or a thermal interface material.
The maximum cable length supported by the SN75LBC172A16DWR depends on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths up to 100 meters at a data rate of 100 Mbps. For longer cable lengths, repeaters or active cables may be required.
The SN75LBC172A16DWR has several configuration options, such as the ability to select the transmission speed, the type of encoding, and the output signal amplitude. These options can be configured using external resistors or through the use of a microcontroller. Texas Instruments provides application notes and design guides to help with configuration and implementation.
The SN75LBC172A16DWR has built-in electrostatic discharge (ESD) protection and latch-up prevention measures. The device can withstand ESD events up to 2 kV human body model (HBM) and 200 V machine model (MM). Additionally, the device has latch-up protection to prevent damage from overvoltage or overcurrent conditions.
SN75LBC172A16DWR datasheet
by Texas Instruments
