Texas Instruments provides a recommended PCB layout in the application note SLVAE04, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
The SN75LBC968DL has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal via array or a copper pour with multiple vias can be used to connect the thermal pad to the thermal plane. Additionally, a thermal interface material (TIM) can be used to improve heat transfer between the device and the heat sink.
The maximum cable length supported by the SN75LBC968DL depends on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths up to 100 meters at a data rate of 1 Gbps. For longer cable lengths, repeaters or active cables may be required.
Yes, the SN75LBC968DL can be used in a redundant or fault-tolerant system. The device has a built-in fault detection mechanism that can detect faults such as cable faults, transmitter faults, and receiver faults. This allows the system to switch to a redundant path in case of a fault, ensuring high availability and reliability.
The SN75LBC968DL has a built-in LIT feature that can be enabled through the device's control pins. The LIT feature allows the device to detect faults in the link, such as cable faults or transmitter faults, and report them to the system. The system can then take corrective action, such as switching to a redundant path or alerting the user.
SN75LBC968DL datasheet
by Texas Instruments
