A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to ensure good heat dissipation.
Use a heat sink, ensure good airflow, and follow the recommended PCB layout. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
The maximum allowed voltage on the input pins is 6V. Exceeding this voltage may damage the device.
Use ESD protection devices, such as TVS diodes, and follow proper handling and storage procedures to prevent ESD damage.
A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for input decoupling. The capacitor should be placed as close as possible to the device's input pins.