The recommended PCB footprint for the STE1000-60T4MI is a rectangular pad with dimensions of 2.5 mm x 1.5 mm, with a thermal pad of 2 mm x 1.5 mm. The pad should have a solder mask defined (SMD) and a non-solder mask defined (NSMD) area for the thermal pad.
To ensure reliable soldering of the STE1000-60T4MI, use a soldering iron with a temperature of 250°C to 260°C, and a solder with a melting point of 217°C to 220°C. Apply a small amount of solder paste to the PCB pad, and use a reflow oven or a hot air gun to solder the component.
The maximum allowed thermal resistance for the STE1000-60T4MI is 10°C/W, which is the thermal resistance from the junction to the ambient (RθJA). This value is specified in the datasheet and should not be exceeded to ensure reliable operation of the device.
The STE1000-60T4MI is not recommended for use in high-humidity environments. The device is rated for operation in environments with a relative humidity of up to 60% at 40°C. Exceeding this rating may lead to reduced reliability or failure of the device.
The recommended storage condition for the STE1000-60T4MI is in a dry, cool place with a temperature range of -40°C to 30°C and a relative humidity of 60% or less. The device should be stored in its original packaging or in a sealed bag to prevent moisture absorption.
