STMicroelectronics provides a recommended layout in the application note AN2352, which includes guidelines for PCB design, component placement, and routing to minimize noise and ensure signal integrity.
The device has a thermal pad on the bottom, which should be connected to a thermal plane on the PCB. Ensure good thermal conductivity by using a thermal interface material and a heat sink if necessary. Refer to the thermal management section in the datasheet for more information.
The maximum cable length depends on the specific application and the signal frequency. As a general guideline, STMicroelectronics recommends keeping the cable length below 10 meters for LVDS signals up to 1.5 Gbps. For longer cables, consider using repeaters or active cables.
The STLDVS050BDR can be configured for differential or single-ended output through the OE (Output Enable) and DE (Differential Enable) pins. Refer to the datasheet's pin description and application notes for specific configuration details.
The recommended power-up sequence is to apply VCC first, followed by the input signals. Ensure that the input signals are stable before applying the clock signal. Refer to the datasheet's power-up sequence section for more information.
STLVDS050BDR datasheet
by STMicroelectronics
