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STMicroelectronics provides a recommended PCB layout in their application note AN5042, which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance and ensure optimal performance.
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To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for voltage and current, and to ensure proper heat sinking and thermal management. Additionally, consider using a thermistor or thermal sensor to monitor the device temperature and implement over-temperature protection.
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Using a Schottky diode instead of a standard diode for the flyback diode can reduce power losses and improve efficiency, especially at high frequencies. However, Schottky diodes have a lower voltage rating and may not be suitable for high-voltage applications. Ensure the Schottky diode is rated for the maximum voltage and current in the application.
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Optimizing the snubber circuit involves selecting the right component values and layout to minimize power loss and EMI. A good starting point is to use the recommended snubber values in the datasheet, and then adjust them based on the specific application requirements. Consider using a common-mode choke and a Y-capacitor to reduce EMI.
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Increasing the switching frequency can reduce the size of the magnetics and improve efficiency, but it also increases switching losses and EMI. Decreasing the switching frequency can reduce EMI and switching losses, but it may require larger magnetics and can affect efficiency. The optimal switching frequency depends on the specific application requirements and constraints.
STPS41H100CR datasheet
by STMicroelectronics
