A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components.
To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range, use a suitable heat sink, and implement thermal monitoring and protection mechanisms.
Key considerations for EMI and EMC compliance include using a shielded enclosure, minimizing loop areas, using decoupling capacitors, and following good PCB layout practices to reduce electromagnetic radiation.
Select input and output capacitors based on the device's recommended capacitance values, voltage ratings, and ESR requirements. Ensure that the capacitors are suitable for the operating frequency and temperature range.
Operating the device at a lower input voltage may affect its performance, efficiency, and reliability. Consult the datasheet for specific guidance on minimum input voltage requirements and potential trade-offs.