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A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components.
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To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range, use a suitable heat sink, and implement thermal monitoring and protection mechanisms.
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Key considerations for EMI filtering and shielding include using a common-mode choke, adding capacitors to filter out high-frequency noise, and shielding the device and surrounding components to prevent electromagnetic interference.
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When selecting input and output capacitors, consider the voltage rating, capacitance value, and equivalent series resistance (ESR) to ensure that they can handle the required ripple current and voltage.
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The recommended settings for soft-start and overcurrent protection features depend on the specific application requirements, but generally involve setting the soft-start time to minimize inrush current and the overcurrent threshold to prevent damage to the device.