The recommended land pattern for the SUP75P05-08-E3 is a rectangular pad with a size of 2.5 mm x 1.5 mm, with a solder mask clearance of 0.2 mm around the pad.
To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of overheating the component.
The maximum operating temperature range for the SUP75P05-08-E3 is -55°C to 150°C, with a storage temperature range of -55°C to 150°C.
Handle the SUP75P05-08-E3 by the body, avoiding touching the leads or the glass passivation layer. Use anti-static precautions when handling the component to prevent damage from electrostatic discharge.
The recommended cleaning process for the SUP75P05-08-E3 involves using a mild detergent and deionized water, followed by a rinse with deionized water and a dry with a lint-free cloth or air blow.