The recommended PCB footprint for the T18504KT10 is a rectangular pad with dimensions of 5.08 mm x 3.81 mm, with a thermal pad of 2.54 mm x 2.54 mm in the center. The pad should have a solder mask defined (SMD) and a non-solder mask defined (NSMD) area around the thermal pad.
To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 217°C to 220°C. Apply a small amount of solder paste to the PCB pads, and use a reflow oven or a hot air gun to solder the component. Avoid using excessive solder or flux, as it can cause bridging or shorts.
The thermal resistance of the T18504KT10 is typically around 1.5°C/W (junction-to-case) and 10°C/W (junction-to-ambient) when mounted on a PCB with a thermal pad. However, this value can vary depending on the specific application, PCB design, and environmental conditions.
Yes, the T18504KT10 is suitable for high-reliability and high-temperature applications. It is designed to operate in temperatures up to 150°C, and its ceramic substrate and wire-bonded construction ensure high reliability and stability. However, it's essential to follow proper design and assembly guidelines to ensure the component's performance and longevity.
Handle the T18504KT10 with care to avoid damage. Store the components in their original packaging or in a dry, clean environment with minimal humidity. Avoid exposing the components to mechanical stress, vibration, or extreme temperatures during shipping or storage.
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