A good PCB layout for the TAS5086DBT should follow the guidelines provided in the TI application note 'TAS5086DBT PCB Layout Guidelines' (SLUA434). This includes keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the power traces.
To optimize the TAS5086DBT for low power consumption, ensure that the device is operated at the lowest possible clock frequency, disable any unused features, and use the power-down mode when not in use. Additionally, consider using a low-dropout regulator (LDO) to reduce power consumption.
The TAS5086DBT has a maximum junction temperature of 150°C. To ensure reliable operation, ensure that the device is mounted on a heat sink or a PCB with good thermal conductivity, and that the ambient temperature is within the recommended range. Also, consider using thermal interface materials to improve heat transfer.
To troubleshoot issues with the TAS5086DBT, start by checking the power supply voltage, clock frequency, and signal integrity. Use an oscilloscope to verify the signal waveforms and ensure that the device is properly configured. Consult the datasheet and application notes for troubleshooting guidelines and common pitfalls to avoid.
To minimize EMI and EMC issues with the TAS5086DBT, ensure that the device is properly shielded, and that the PCB layout follows good EMI design practices. Use a common-mode choke or ferrite bead to filter the power supply, and consider using EMI-absorbing materials in the system design.
TAS5086DBT datasheet
by Texas Instruments
