A good PCB layout for the TAS5142DKD involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the decoupling capacitors close to the device. TI provides a recommended PCB layout in the datasheet and application notes.
To optimize thermal performance, ensure good airflow around the device, use a heat sink if possible, and avoid blocking the thermal pads on the package. TI also provides thermal design guidelines in the datasheet.
The recommended power-up sequence is to apply the analog supply voltage (AVDD) first, followed by the digital supply voltage (DVDD), and then the clock signal. This ensures proper device initialization and prevents latch-up.
TI provides a troubleshooting guide in the datasheet and application notes. Common issues include incorrect power-up sequence, inadequate decoupling, and poor PCB layout. Use an oscilloscope to check signal integrity and voltage levels.
To minimize EMI and ensure EMC compliance, use a shielded enclosure, keep the device away from antennas and other EMI sources, and follow good PCB layout practices. TI provides EMI and EMC guidelines in the datasheet and application notes.