Texas Instruments provides a recommended PCB layout in the TAS5261DKDRG4 datasheet (SLUS933) and in the TAS5261DKDRG4 Evaluation Module (EVM) user's guide (SLAU292). It's essential to follow these guidelines to ensure proper thermal management, noise reduction, and signal integrity.
The TAS5261DKDRG4 output power level can be configured by adjusting the RSET resistor value, which sets the current limit. The datasheet provides a formula to calculate the RSET value based on the desired output power. Additionally, the device can be configured using the I2C interface to adjust the output power level dynamically.
The TAS5261DKDRG4 has a high-power density, and thermal management is crucial. Texas Instruments recommends using a heat sink, thermal vias, and a thermal pad on the PCB to dissipate heat. The device also has a built-in thermal protection feature that shuts down the device if the junction temperature exceeds 150°C.
To ensure EMC, follow proper PCB layout and design guidelines, use shielding and filtering components, and implement proper grounding and decoupling techniques. The TAS5261DKDRG4 datasheet and EVM user's guide provide guidance on EMC considerations.
The TAS5261DKDRG4 is a high-power, high-fidelity audio amplifier with a unique combination of features, such as high output power, low distortion, and high efficiency. Compared to other similar devices, it offers a higher power-to-package-size ratio, making it suitable for compact designs. The datasheet and product page provide detailed comparisons with other Texas Instruments audio amplifiers.
TAS5261DKDRG4 datasheet
by Texas Instruments
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