A good PCB layout for the TAS5613ADKDR involves keeping the power supply lines (VIN, VCC) separate from the analog signal lines, using a solid ground plane, and placing the decoupling capacitors close to the device. TI provides a recommended PCB layout in the datasheet and application notes.
To optimize thermal performance, ensure good airflow around the device, use a heat sink if possible, and avoid blocking the thermal pads on the bottom of the package. TI provides thermal design guidelines in the datasheet and application notes.
The recommended input coupling capacitor value is 1-10uF, and the recommended output coupling capacitor value is 10-100uF. The exact value depends on the specific application and frequency response requirements.
The TAS5613ADKDR can be configured for mono or stereo operation by connecting the appropriate pins. For mono operation, connect the LOUT+ and ROUT+ pins together, and for stereo operation, keep them separate. Refer to the datasheet for specific pin connections.
The TAS5613ADKDR can handle up to 20W of power per channel, but the actual power handling capability depends on the specific application, supply voltage, and thermal design.
TAS5613ADKDR datasheet
by Texas Instruments
