STMicroelectronics provides a recommended PCB layout in the application note AN5323, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
The input capacitor selection depends on the input voltage, current, and frequency. A general guideline is to choose a capacitor with a voltage rating at least 1.5 times the maximum input voltage, and a capacitance value between 1uF to 10uF. The X7R or X5R dielectric type is recommended for its stability and low ESR.
The maximum allowed voltage drop across the TD351ID is typically around 1.5V to 2V, depending on the specific application and operating conditions. Exceeding this voltage drop may lead to reduced efficiency, increased heat generation, or even device failure.
To ensure the TD351ID operates within its SOA, monitor the device's junction temperature, input voltage, and output current. Make sure to stay within the recommended operating conditions, and consider implementing thermal monitoring and overcurrent protection to prevent damage or failure.
A combination of thermal design techniques is recommended, including a heat sink with a thermal interface material, thermal vias on the PCB, and a well-designed thermal conduction path. The goal is to keep the junction temperature below 150°C to ensure reliable operation and long-term reliability.
TD351ID datasheet
by STMicroelectronics
