A good PCB layout for the TDA2616Q/N1,112 should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper coverage around the device. Avoid routing high-frequency signals near the device to minimize electromagnetic interference.
To ensure EMC, follow proper PCB design guidelines, such as separating analog and digital grounds, using decoupling capacitors, and shielding the device with a metal can or a shielded enclosure. Additionally, ensure that the device is properly grounded and that all cables are properly shielded.
Use a high-impedance probe to measure the output voltage, and ensure the oscilloscope is set to the correct bandwidth. Use a low-capacitance probe to minimize loading effects. For power supply rejection ratio (PSRR) measurements, use a high-impedance probe and a low-noise power supply.
Implement overvoltage protection using a voltage supervisor or a dedicated overvoltage protection IC. Ensure the protection circuitry is designed to respond quickly to voltage surges and has a low voltage tolerance to prevent damage to the device.
Ensure good thermal conductivity between the device and the heat sink or thermal pad. Use thermal interface materials (TIMs) to fill gaps and improve heat transfer. Consider using a heat sink with a high thermal conductivity and a low thermal resistance.
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