A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the analog and digital grounds. Also, ensure that the input and output tracks are as short as possible and well-decoupled.
To ensure EMC, use a shielded enclosure, and ensure that all cables are properly shielded and filtered. Also, use a common mode choke on the power supply lines, and add a ferrite bead to the output stage. Additionally, ensure that the PCB layout is optimized for minimal radiation.
Use a combination of ceramic and electrolytic capacitors for power supply decoupling. A 10uF ceramic capacitor and a 100uF electrolytic capacitor in parallel, placed close to the device, are recommended. Also, add a 10nF capacitor in parallel with the 10uF capacitor to filter high-frequency noise.
Use an oscilloscope to check the input and output waveforms, and verify that the power supply voltage is within the recommended range. Check for any signs of overheating, and ensure that the device is properly soldered and mounted. Also, consult the datasheet and application notes for troubleshooting guidelines.
Use a heat sink with a thermal conductivity of at least 1 W/m-K, and apply a thermal interface material (TIM) with a thermal conductivity of at least 5 W/m-K. Ensure that the heat sink is properly attached to the device, and that the system is designed to allow for adequate airflow.
TDA8007BHL/C3,118 datasheet
by NXP Semiconductors
