A good PCB layout is crucial for the TDA8579T/N1,112. Ensure that the input and output stages are separated, and the power supply lines are decoupled. Use a star-ground configuration and keep the signal paths as short as possible. NXP provides a recommended PCB layout in the application note AN10365.
The choice of external components, such as resistors, capacitors, and inductors, depends on the specific application and desired performance. Refer to the datasheet and application notes for guidance on component selection. Additionally, NXP provides a component calculator tool to help with component selection.
The maximum power dissipation of the TDA8579T/N1,112 is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 2.5 W at an ambient temperature of 70°C. However, it's essential to perform thermal calculations and consider the specific application's requirements.
To ensure EMC, follow proper PCB design practices, such as using a solid ground plane, minimizing loop areas, and using shielding if necessary. Additionally, ensure that the amplifier is properly decoupled, and the input and output stages are filtered according to the specific application's requirements.
The recommended operating voltage range for the TDA8579T/N1,112 is 4.5 V to 18 V. However, the device can operate down to 3.5 V, but with reduced performance. It's essential to ensure that the voltage supply is stable and within the recommended range to maintain optimal performance.
TDA8579T/N1,112 datasheet
by NXP Semiconductors
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