A good thermal design should be used to ensure the device operates within the recommended temperature range. A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 4 layers (2 signal, 1 power, and 1 ground) is recommended for the PCB.
To ensure EMC, use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead on the power supply lines. Additionally, use a low-pass filter on the output stage to reduce electromagnetic radiation.
Use a 10uF ceramic capacitor in parallel with a 100nF ceramic capacitor, both connected as close as possible to the device's power pins. This will help to filter out high-frequency noise and ensure stable operation.
Use a voltage regulator or a voltage supervisor to ensure the device operates within the recommended voltage range (8V to 18V). Add overvoltage protection (OVP) and undervoltage protection (UVP) circuits to prevent damage from voltage transients or faults.
A heatsink with a thermal resistance of less than 10°C/W is recommended. The heatsink should be attached to the device using a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK.
TDA8920CTH/N1,118 datasheet
by NXP Semiconductors
