A good thermal design should be used to ensure the device operates within the recommended temperature range. A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a metal plate to dissipate heat efficiently.
To ensure EMI compliance, use a shielded enclosure, keep the PCB layout compact, and use a common-mode choke or ferrite beads on the input and output lines. Additionally, use a low-pass filter on the output stage to reduce high-frequency noise.
The recommended power-up sequence is to first apply the analog power supply (VCC) and then the digital power supply (VDD). This ensures that the analog circuitry is powered up before the digital circuitry.
Use an oscilloscope to check the input and output waveforms, and verify that the power supplies are within the recommended range. Check for proper grounding and decoupling of the device. If issues persist, consult the NXP Semiconductors support team or a qualified engineer.
The maximum allowed output current for the TDA8953J/N1,112 is 3.5A per channel. Exceeding this limit may cause the device to overheat or fail.
TDA8953J/N1,112 datasheet
by NXP Semiconductors
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