A good PCB layout is crucial for the TDA9991HL. Ensure that the analog and digital grounds are separated, and the analog ground is connected to the digital ground at a single point. Keep the analog and digital signal paths separate, and use a star-shaped layout for the power supply connections.
The TDA9991HL can dissipate up to 2.5W of power. Ensure good thermal conductivity by using a heat sink or a thermal pad on the exposed pad of the IC. Keep the ambient temperature below 70°C and avoid blocking airflow around the IC.
The recommended input coupling capacitor value is 10uF to 22uF, and the output coupling capacitor value is 10uF to 47uF. However, the optimal value may vary depending on the specific application and frequency range.
Use a pull-up resistor of 1kΩ to 10kΩ on the SCL and SDA lines. Ensure that the I2C clock frequency is within the recommended range of 100kHz to 400kHz. Use a repeated start condition for multiple byte transfers, and avoid using the I2C bus for other devices during configuration.
Power up the TDA9991HL in the following sequence: VCC, AVCC, and then DVCC. Power down in the reverse sequence. Ensure that the power supply voltage is stable and within the recommended range before configuring the IC.
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